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Brand Name : HUITIAN
Model Number : 0113
Certification : SGS
Place of Origin : CHINA
MOQ : 50kg
Price : Negotiation
Payment Terms : L/C, T/T
Supply Ability : 1000kg/Month
Packaging Details : 2kg/bucket
Delivery Time : 5-8 days
Physical Form : paste
Color : white
Main Component : polysiloxane
Density : 2.9g/cm³
Volatility(200℃,24h) : 0.2%
Working Temperature : -50~200℃
Thermal Conductivity : 2.1W/(m•K)
0113 is a one-component Silicone Thermal Conductive Grease suitable for gap filler and reducing the temperature of electronic components.
Product Features:
Main Applications:
Widely used for the thermal conductivity of electronic components including the filling of gap between CPU and heat sink.
To fill the gap between high-power audion, thyristors and basic materials such as copper and aluminum reduce the temperature of electronic components.
Item | Unit | Typical Value |
Item No. | 0113 | |
Physical Form | paste | |
Color | white | |
Main Component | polysiloxane | |
Density | g/cm3 | 2.9 |
Penetration Degree | 1/10cm | 280 |
Volatility(200℃,24h) | % | 0.2 |
Volume Resistivity | Ω*cm | 1.0×1015 |
Dielectric Strength | KV/mm | 24 |
Breakdown Voltage | KV/mm | 20 |
Surface Resistance | Ω | 2.4×1014 |
0.1mm Thermal Resistance | m2K/W | 0.00011 |
Work Temperature | ℃ | -50~200 |
Heat Conductivity Coefficient | W/(m·K) | 2.1 |
Packing:
2kg/bucket, 6bukets/carton
Storage:
Store it in dry and cool places at the temperature of 0~35℃
Shelf life is 12 months
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0113 Thermal Conductive Grease 2.1W/m·K Gap Filler For CPU And Led Chip Nontoxic, non-corrosive to PCB and metal Images |